Package on Package (PoP)

Wednesday, November 24, 2010

Electronics Manufacturing Trends- Package on Package

Welcome to Lean Streams's Blog. Our purpose is th share World Class Manufacturing Trends- Technical and Financial.
We have decided to use "Package-on-Package placement(PoP) as our Initial Electronics Manufacturing Trend to Share and will explain how to achieve PoP placement with Fuji's NXT and AIMEX Platforms. Many of our customers are already manufacturing their products in N. California using PoP techniques with the NXT platforms. We hope this information in the article will be of some use to you.

1 comment:

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