Package on Package (PoP)

Wednesday, November 24, 2010

PoP Placement at the NXT and AIM

5-1.Placement Machines 
5-1-1.High Precision Head - Placement Accuracy Z-axis Control
The G04 head which has a four fixed nozzle configuration can place parts with the same high precision as the H01 head due to its exact mechanical structure. Low load placement(1.5 to 2N) is achieved using nozzle springs which minimize the weight.
Furthermore, the Z-axis speed can be specified and placement height can be controlled to support dipping or stack placement. The NXT and AIM have the advantage that placement heads can be exchanged quickly when introducing PoP placement to a line.
5-1-2. Productivity - Batch Dipping with Multiple Nozzles
The G04 head considers productivity during mass production and supports individual dipping for each nozzle as well as simultaneous dipping for four nozzles. Furthermore, the vision processing and dipping order can be selected to match the customer's needs.

5-1-3.Transfer Check Function-Vision Recognition
The images below are images acquied during vision processing after dipping. It is easy to confirm that the bump on the top right is not coated with solder paste but the remaining bumps are coated with solder paste. NXT and AIM machines can detect whether solder paste has been transfered to bumps. During the detection process, it is easy to specify data acquired for the check based on the actual image.

5-2.Dip Process Equipment
Simply by purchasing and adding a dip flux unit which can be loaded onto a NXT or AIM, dip processing is possible. the dip flux unit maintains the required film thickness by rotating the flux reservoir and using a squeegee. This unit can be used with numerous types of flux and solder paste for transfer to flip chips and shield casing.

5-2-1.Adjusting and Checking the Film Thickness
A micrometer is used to adjust the film thickness at the unit and to adjust the lowering and raising action of the squeegee. When checking the film thickness, use a comb gauge. The dip flux unit must be set on the machine to perform adjustments and checks.
An option is available with the rotary type dip flux unit to automatically change the film thickness.
5-2-2.Flux and Solder Paste Automatic supply
When the amount of flux is the reservoir becomes insufficient, the dip flux unit automatically supplies flux. When the flux reaches the required amount, the flux supply stops and production can resume. Solder paste can also be controlled in the same way.
5-2-3.Simple Operation and Maintenance
Without removing the dip flux unit from the machine, maintenance can be performed for the squeegee and flux reservoir by simply pulling out the unit to a maintenance position. Furthermore, no tools are required to remove or attach the flux reservoir.
5-3.Machine Configuration Settings
PoP Placement can be performed at the NXT or AIM after setting the following three items Fuji Flexa.
  • Setting for flux application
        [Shape Process] - [Flux] - [Generic] - [Do Flux]
  • Mounting slot setting for dip flux unit
        [Configuration] - [Feeder Setup] - [Feeder Name]
  • Specifies package to stack(stack target)
        [Coordinate] - [Stack Target]

    Other selections and changes are available for the conditions of each operation.

        [Accessory Software]
  • Time setting for part vision processing and dipping
  • Parameter setting for stirring flux

        [Fuji Flexa]
  • Parameter setting for dipping
  • Parameter setting for stack placement
  • Setting for transfer check function
       *Only solder paste can be used with vision type 142

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